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[Sticky] iPad Pro 12.9 Hardware Advice!  


iOracle Moldova
Joined:5 years  ago
Posts: 7213
04/10/2017 19:38  

To unsolder NAND was enough 340C 100% air flow 10mm nozzle this temp was not enough to melt all pads and this is good because it is safe to not overheat something around like RAM and as you can see no pad was removed from logic board or NAND itself.

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